Heat dissipation structure ceramic substrate

Descriptions

The thin   and complex shape of the wall makes it possible to produce   a cooling and heat exchange components with a lower heat capacity   and a lighter weight than that of the metal, thereby contributing to   improved cooling efficiency,   energy   conservation, and reduced maintenance. It can be used for various applications other than cooling and temperature   regulation by using complex shapes.

Features

From freedom

High temperature resistance

Chemical resistance

Bonding   technology

High efficiency heat exchange

Usage

Parts for heat exchangers, manifolds, microreactors, thermal insulation parts, etc

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